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AMICCOM announced A3107M0 The Bluetooth low energy (Bluetooth LE) Mesh /Bluetooth® LE Central SoC chip
- 2018/5/21
AMICCOM Electronics Corporation (AMICCOM), a professional wireless chip supplier, announced a Bluetooth low-energy (Bluetooth LE) SoC chip for Mesh/ Bluetooth® LE Central, named A3107M0. A3107M0 integrates the ARM® Cortex®-M0 with 256 Kbytes of Flash Memory, 32KBytes of SRAM, and 23/32 GPIOs and various digital interfaces.

A3107M0 is compatible with the A8107M0 pin, and is a new RF design with excellent features from AMICCOM. For DC-DC turn on mode with 3.3V input, the RX mode is 6.6mA and the TX mode is 9.3 mA (+5dBm). It also has a programmable RF output power of -14dBm ~ +6dBm and RX sensitivity of -94dBm (@1Mbps GFSK),the data rate is programmable form 2Mbps to 250Kbps. The internal CPU core is the ARM Cotrex-M0 which provides fast operation. A3107M0 is equipped with a variety of digital interfaces such as UART, I2C, SPI, PWM and Timer. These interfaces share the pin with the GPIO and can be used depending on the applications. A3107M0 has built-in 8-chnnel 12-bit ADC for external signal measurement.

AMICCOM has already developed Mesh and BLE Central Bluetooth low-power protocol stack which are certified by the Bluetooth SIG, which complies with the Mesh profile and Bluetooth 5.1 specifications. It can be applied to the Bluetooth® LE SoC chip that has been mass-produced by AMICCOM to upgrade the existing Bluetooth® LE 4.0 protocol stack to Bluetooth® LE 5.1 which is compatible with the requirements of Bluetooth® LE 5.1.
Overall, the A3107M0 is a high-performance, low-power Bluetooth LE SoC chip that provides a convenient and easy to develop protocol stack that supports multiple digital interfaces and full I/O. All functions are integrated into QFN5x5 and QFN6x6 packages.

Supply and packaging
A3107M0 package is 5 mm x 5 mm QFN 40/32 and 6 mm x 6 mm QFN 48. AMICCOM legal distributors provide sample and evaluation kit.
Please contact AMICCOM for more detail.